On Friday, March 8, 2024, 6G Communications will be introduced to the world, bringing with it a host of benefits, as long as certain challenges can be overcome. According to Dr. Peter Harrop, CEO of analysts Zhar Research, a market worth over $10 billion is waiting for those who can provide better low loss and thermal materials and structures for 6G. These opportunities stem from the higher frequencies, power-hungry infrastructure, and smaller client devices that will be utilized in the 6G network.
To help navigate this market, Zhar Research has released a 318-page report titled “6G Communications Low Loss and Thermal Materials and Structures: Detailed Technology Analysis, Roadmaps and 32 Market Forecast Lines 2024-2044.” This comprehensive report takes a deep dive into the challenges and opportunities presented by 6G, providing valuable insights for those looking to enter the market.
The report recommends that both low loss and thermal materials be considered together, as many potential partners, competitors, and research sources are involved in both areas. It also highlights the potential for materials such as aerogel silicas, which can be used for both low loss and thermal purposes. The report is constantly updated, providing readers with the latest information and analysis.
Key questions addressed in the report include the winning and losing chemistries and companies, potential partners and acquisitions, and the emergence of new competition. It also offers 20-year roadmaps for decision making, technical capability, and adoption, as well as identifying gaps in the market and unsolved problems that present opportunities. The report delves into the evolution of 6G, including its phases, materials, frequencies, and functionality, and offers 32 20-year forecasts for low loss and thermal materials and their hosts.
Presented in the form of timelines, infograms, SWOT appraisals, graphs, tables, and roadmaps, the report offers a wealth of information without nostalgia or academic obscurity. It also includes a list of relevant research papers and further reading recommendations for those looking to dig deeper into the subject.
For those with limited time, the Executive Summary and Conclusions section provides a comprehensive overview, with 30 pages of choices, trends, possibilities, impediments, SWOT appraisals, and technology comparisons, as well as 20 primary conclusions. The following pages include all the forecasts and roadmaps in both table and graph form, with accompanying commentary.
Chapter 2, “Introduction,” critically explains the 6G dream and reality and introduces a significant number of materials and manufacturing technologies involved in 6G. Chapter 3, “Low loss materials and applications for 6G,” takes a deep dive into the key parameters for 6G dielectrics at various levels and explores the changes in low-loss material choices from 5G to 6G. It also presents a comparison of permittivity and dissipation factor for various dielectric families, as well as a choice of low permittivity, low loss dielectrics for 6G.
Chapter 4, “Epsilon near zero ENZ materials and applications for 6G,” delves into this aspect of materials for 6G. The report then shifts its focus to thermal materials, starting with chapters on thermally conductive structures, such as thermal interface materials and heat spreaders. It also explores evaporative, radiative, and active and passive solid-state cooling and thermal insulation solutions.
Chapter 5, “6G thermal management materials and applications: the big picture,” provides an overview of thermal materials for 6G, while Chapter 6, “Thermal management materials for 6G smartphones, IOT nodes, and other client devices,” delves into specific applications. Chapter 7, “Wild cards for 6G thermal management: thermal metamaterial, thermal hydrogel, thermoelectric heat pump” speculates on potential future developments in thermal materials. Chapter 8, “Solid state cooling,” delves into the use of smart materials for cooling in 6G applications. Finally, Chapter 9, “Metamaterials for 6G communications,” explores the use of metamaterials in thermal management and other aspects of 6G.
In conclusion, “6G Communications Low Loss and Thermal Materials and Structures: Detailed Technology Analysis, Roadmaps and 32 Market Forecast Lines 2024-2044” is an essential resource for materials and subsystem suppliers, investors, product integrators, equipment manufacturers, and others in the 6G supply chain. The report offers valuable insights and analysis that can help companies navigate the challenges and opportunities presented by the 6G market.
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